Xindaxin has special abrasive powder for wire-sawing semiconductor material, which is different fro

Xindaxin has special abrasive powder for wire-sawing semiconductor material, whichis different from traditional SiC abrasive powder, manufactured through many strictworking procedures, and under 12 quality control targets. The products havethe characteristics of high purity, high hardness, narrow distribution, good grainshape, no coarse grains and can reach high quality requirement. It is usedfor wire-sawing 3-8 inch single-crystal silicon, solar cell multi-crystal silicon,gallium arsenide, quartz crystal and etc.. The powder is the engineering materialfor semiconductor and solar cell industries. It can improve cutting efficiency,reduce production cost, and guarantee the quality of the wafers.Packing: 20kg, 25kg, 1000kg

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