Thermal conductive silicone sealant
Features Applications
.Thermal conductivity:1.0W/M-K . Power transistor module
. Two components: A & B . LED driving power
. Auto-removing foam . Integrated chipset
. Good high & low temperature resistance . LED encapsulation
. Good physical and chemical stability . Power module
. RoHS and UL compliance . Telecom devices
. Others
Method of Use
Compound A and B per weight rate
. Fill and seal after completely compounding.
Physical Properties:
PROPERTY | PC100-01 | PC100-02 | TEST METHOD |
Color | A: Gray B:Lucency | A: Gray B:Lucency | Visual |
A/B compounding rate | 10:1 | 10:1 | ---- |
Hardness | 60°C Shore C | 60°C Shore C | ASTM D2240 |
Adhesiveness | 5000cps | 5000cps | ASTM D412 |
Work time (Hour, 25°C) | 1H | 5H | ---- |
Room Solidifying Time | 2H | 24H | ---- |
Density | 1.7 | 1.7 | ASTM D792 |
Thermal conductivity | 1.0 W/M-K | 1.0 W/M-K | ASTM D5470 |
Expired Time | 12 months under 25°C with sealed container. |
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Two components thermal conductive silicone sealant