Waterproof, shockproof,insulating Potting silicone encapsulant two components silicone adhesive Mix ratio: 10:1 Heat cure

Features                                                                                       Applications                             

 .Thermal conductivity: 1.0 W/M-K                                        . Power transistor module               

 . Two components: A & B                                                    . LED driving power          

 . Auto  deaeration                                                                   . Integrated chipset

 . Good high & low temperature resistance                      . LED encapsulation

 . Good physical and chemical stability                             . Power module

 . REACH RoHS and UL compliance                                 . Telecom devices     

                                                                                                  . Others

PROPERTY	PC100-01	PC100-02	TEST METHOD
Color	A: Gray B:Lucency	A: Gray B:Lucency	Visual
Mix Ratio	10:1	10:1	----
Hardness (cured)	60°C  Shore C	60°C  Shore C	ASTM D2240
Viscosity	5000cps	5000cps	ASTM D412
Pot Life  (Hour, 25°C)	1H	5H	----
Room Solidifying Time	2H	24H	----
Density	1.7	1.7	ASTM D792
Thermal conductivity	1.0 W/M-K	1.0 W/M-K	ASTM D5470
Shelf Life	12 months under 25 °C in sealed container.

                

LED lighting silicone pouring sealant