1.epoxy resin discription:
High pure filler
Excellent manufacturability
Excelleexcellent lustrous surface
Excellent insulating property
2.Application:
Adhesive for advanced artware ,
Adhesive for solar battery
Adhesive for electron device
Adhesive for contact agent
3.Technical data:
temperiture(°c) | curing time(hour) |
25 | 8 |
60 | 40~60 |
80 | 30~40 |
4.Ristriction:
Pretreatment: keep clean, dry and completely degreasing before touch the surface of the object
preheat substrate (50-60°C) surface sizing vacuum deaeration curing (1hr /70°C)
Mixing: mixed 888A and 888B according to the regulated ratio
5. Usage:
Mix the part 888A and the part 888B in the ratio of 100:50-60
Usuable time: it's according to the mixing gross and the temperature, usually 100g, 25°C about 30-40 mins.
6. Packaging and store:
A/B both 5kg/bucket.
Seal up for 6 months, immediately seal up after opening.
7.Safety used:
Advoid swallowing, the curing surface is easy to fog when wet, recommend warming
8.Tread message ID: gdjianneng
5028A/B epoxy resin electronic potting adhesive