1

Layer

1-30 layer

2

Material

FR4,CEM-1,CEM-3,Hight TG

3

Board thickness

0.6mm-2mm

4

Max.finished  board side

650mm*550mm

5

Min.drilled hole size

0.25mm

6

Min.line width

0.075mm(3mil)

7

Min.line spacing

0.075mm(3mil)

8

Surface finish/treatment

Chemical tin,Chemical gold,Immersion gold,Osp,Gold plating

9

Copper thickness

1-4.0oz

10

Solder mask color

green,black,white,red,blue,yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton paking

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

ISO 9001:2000   ISO 14001:2004   ISO/TS 16949

15

Profiling punching

Routing,V-Cut,Beveling

16

Providing OEM service to

all sorts of printed circuit board assembly