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SB-318 (XJ399) Copper clad laminated sheet consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil. Having high dimensional stability, good punching behaviour at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc.
Standard: CPFCP-04, Equivalent to IEC-249-2-2, NEMA: XPC
Technical requirements are shown in table 1 and 2
Table 1 Nominal thickness and tolerance
Nominal thickness mm | Tolerance at single point mm |
0.8 | ±0.09 |
1.0 | ±0.11 |
1.2 | ±0.12 |
1.6 | ±0.14 |
2.0 | ±0.15 |
Note: 1. Normal dimension: 1220±20mm×1020±20mm | |
Table 2: Technical requirements
No. | Item | Unit | Conditioning | Normal Value | Typical Value |
1 | Solder float at 260, min. | s | A | 10 | 15 |
2 | Peel strength min. | N/mm | A S-5S/260 | - 1.0 | 1.4 1.2 |
3 | Flexural strength min. | MPa | A | 80 | 100 |
4 | Water absorption max. | % | E-24/50+D-24/23 | - | 1.8 |
5 | Dissipation factor max. | - | C-96/20/65 C-96/20/65+D-48/50 | - - | 0.05 0.10 |
6 | Dielectric constant max. | - | C-96/20/65 C-96/20/65+D-48/50 | - - | 5.5 6.0 |
7 | Insulation resistance min. | MΩ | C-96/20/65 C-96/20/65+D-2/100 | - - | 5×104 50 |
8 | Volume resistivity min. | MΩ·m | E-2/100 C-96/20/65+C-96/40/90 | 10 100 | 15 180 |
9 | Surface resistance min. | MΩ | E-2/100 C-96/20/65+C-96/40/90 | 30 1×103 | 70 1.5×103 |
10 | Thermal resistance | - | E-1/180 | - | No blistering and peeling-off |
11 | Alkali resistance | - | 5%NaOH, 40, 5min | - | Without notable changes in apperance |
Remarks: ALL data listed in above table are typical values from SB-318 (XJ-399) CCL in thickness of 1.6mm and with copper foil of 35μm.
HOT!XPC Copper clad laminated sheet