During developing:Hardware/software design, mechanical structure design, assembling and testing.

Electronic ODM Service

   The electronics design services we can provide

   Design of low consumer products

   Rapid prototype design for your original ideas

   Replacement of legacy hardware and parts with modem designs

   PCB layout

 One stop solution for the electronics products developing

Built-in Electronics hardware designBuilt-in Electronics software, MCU/DSP programmingBuilt-in product shape designBuilt-in mechanical structure designBuilt-in plastic injection mold design and makingBuilt-in metal stamping/shaping molds design and making

Notes:We will protect the intellectual property of the products for our customers, and provide the complete documents to our customers when the project is finished. So our customers are fully controlled the new products

Specialize in :

1. R&D embedded electronic products. Proficiency in embedded system development with ARMs such as Philips, Samsung, Atmel etc and MCUs such as Atmel, Microchip, Ti, ST, Sunplus, Winbond.

2. R&D products of low-power and advanced controlled electronic.

3. R&D products of consumer and automotive electronics.

4. R&D low-frequency analog circuit (<30MHz).

5. R&D embedded system architecture and RTOS. Proficiency in IDEs such as Keil, IAR EWARM, RealView MDK, Tornado Workbench, VisualDSP++, etc.

ODM Process

1	Filling Project requirements	See Note 1
2	Project assessment
3	Signing ODM agreement after preliminary intent on cooperation	See Note 2
4	Project design cost payment
5	Solution design	See Note 3
6	Solution confirmation
7	Prepaid R&D costs
8	Product R&D and sample manufacturing	See Note 4
9	Sample confirmation
10	Balance due of design payment
11	Signing trial production of small quantities agreement
12	Trial production payment
13	Trial production	See Note 5
14	Trial production determination
15	Signing production order contract
16	Prepaid cost of the contract
17	Mass production
18	Providing product specification and manual
19	Shipment
20	Balance due of contract payment
21	After-sale tracking service

1.1 Filling Project requirements (See Note 1)

2.1 Project assessment

2.2 Signing ODM agreement after preliminary intent on cooperation (See Note 2)

3.1 Project design cost payment

3.2 Solution design (See Note 3)

3.3 Solution confirmation

4.1 Prepaid R&D costs

4.2 Product R&D and sample manufacturing (See Note 4)

4.3 Sample confirmation

4.4 Balance due of design payment

4.5 Signing trial production of small quantities agreement

4.6 Trial production payment

4.7 Trial production (See Note 5)

5.1 Trial production determination

5.2 Signing production order contract

5.3 Prepaid cost of the contract

5.4 Mass production

5.5 Providing product specification and manual

5.6 Shipment

5.7 Balance due of contract payment

6.1 After-sale tracking service

Note:

1. The payment rate and R&D circle can be provided after the project is determined.

2. The content of the agreement includes: customer requirements, project design cost, product R&D cost, mechanical mould opening cost, software development tools and the R&D plan.

3. The content of the solution includes programming of the hardware, software and mechanical design, product cost accounting.

4. This process includes the design and development of the hardware, software and mechanical casting, and manufacturing the qualified sample product.

5. This process includes small batch production, product inspection and manufacture procedure optimation.

ODM Electronic products