This machine is essential equipment in the photovoltaic industry to produce battery silicon of solar energy.

      This machine can cut simultaneously ingots or bars into thousands of chips by multi-line cutting technology, which is realized through the high-speed movement of metal wires, bringing abrasive material to processing regions to rub the job. The machine is suitable for cutting hard and brittle materials such as monocrystalline (polycrystalline) silicon, quartz, crystal, ceramics, artificial gem, magnetic materials, chemical compound, and oxidizing materials. Therefore, it is essential equipment in the photovoltaic industry to produce battery silicon of solar energy.

Max. cross-section of workpiece                                      220×220mm

Max. length of workpiece                                                  820mm

Min. thickness of chip                                                         0.1mm

Max. working stroke                                                         300mm

feeding speed of workpiece                                             0~10mm/min

speed of rapid approach and withdrawal                          300mm/min

the diameter of cutting wire                                             0.1~0.16mm

the tension of steel wire                                                  10~35N

the diameter of home roll                                                φ320mm

Max. cutting linear velocity                                              15m/s

the capacity of abrasive slurry tank                                 360L

resolution of feeding axis                                                0.001

total power capacity                                                       150KVA

overall dimension                                                            4040×2600×3650mm

total weight of the machine                                              18T

HJMT GK4620 multiwire silicon chips cutting machine