HS fins with high density increase area of the heat dissipation
Full Cu material, molding success one time
Skiving craft wit
Features: | Heatsink methods: | Active | Applicable scope: | Intel LGA771 Series | Main Process: | Skiving+Fan | Heatsink Material: | Copper | Heatsink Dimension: | 91mm(L)×64mm(W)×28(H)mm | Bearing Type: | Two-ball | Rated Voltage | 12VDC | Noise: | 25.5dBA(Max) | Fan Speed | 5000rpm | Operating Voltage: | DC12V 0.8A | Product Features:HS fins with high density increase area of the heat dissipationFull Cu material, molding success one timeSkiving craft with high precisionEasy and reliable to install with high steadiness |
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ACTIVE SERVER CPU COOLER 771