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; Features and Benefits:
High temperatures capabilities Excellent plasma resistance Lowest particulation Wide chemical resistance Cost-effectiveRecommended Processes:
Deposition: LPCVD, CVD, APCVD, HDPCVD, PECVD, RPCVD, SACVD Plasma etch: oxide and metal Wet etch process Metalization: PVD, evaporation, sputtering Ion ImplantRecommended Wet Processes
Water preparation, cleaning and rinsing Etching StrippingCopper PlatingJN-575 FFKM