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Flex print circuit board
We can provide all type of FPC production include 8 lay rigid-flex board .HDI (blind and bury board )
| number of layer | 1-8 (rigid-flex & multilayer FPC ) | ||
| Min.TrackWidth /Spacing | Single Side | 0.030mm/0.040mm | |
| Double Side | 0.030mm/0.050mm | ||
| Min. Hole Diameter | Drilling P.T.H. | 0.2mm | |
| Punching | 1.0mm | ||
| Dimension | Conductor Width (W) | 0.020mm | W 0.5mm |
| Hole Diameter (H) | 0.05mm(with P.T.H. 0.1mm) | H 1.5mm | |
| Accumulated Pitch (P) | 0.015mm | P 25mm | |
| Outline Dimension(L) | 0.05mm | L 50mm | |
| Conductors and Outline ( C ) | 0.15MM(Special 0.07mm) | C 5.0mm | |
| Conductors and Coverlay | 0.3-0.5mm | ||
| Surface Treatment on terminals and land Areas | Soft or Hard Ni/Au Sn/Pb(2-60um) Primary Flux carbon Printed (4-10um) Silver Gel printed | ||
| Insulation Resistance | 1000MW | IPC-TM-650 2.6.3.2 at Amblent | |
Flex print circuit board