1

Layer

1-30 layer

2

Material

FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum

3

Board thickness

0.2mm-7mm

4

Max.finished board side

500mm*500mm

5

Min.drilled hole size

0.25mm

6

Min.line width

0.075mm(3mil)

7

Min.line spaceing

0.075mm(3mil)

8

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

Profiling Punching

Routing,V-CUT,Beveling

16

Assembly Service

Providing OEM service to all sorts of printed circuit board assembly