CPU Thermal Paste-ST25g with SGS&MSDS
Product Application
1Electronics parts,IC,CPU,MOS.
2LED,M/B,PS,Heat sink,LCD-TV,NB,PC,and so on.
3DDRII Module,DVD applications,and so on.
Main features
Items | HY510 | HY520 | HY530 | HY550 | Units |
Color | Grey | Grey | Grey | Grey | NO |
Thermal Conductivity | 0.965 | 1.382 | 1.695 | 1.974 | W/m-K |
Thermal Impedance | 0.225 | 0.214 | 0.126 | 0.105 | °C- in2/W |
Specific Gravity | 2.0 | 2.2 | 2.3 | 2.5 | No |
Evaporation | 0.001 | 0.001 | 0.001 | 0.001 | % |
Bleed | 0.05 | 0.05 | 0.05 | 0.05 | % |
Dielectric Constant | 5.1 | 5.1 | 5 | 5.1 | No |
Viscosity | non-flowing | non-flowing | non-flowing | non-flowing | NO |
Thixotropic Index | 380+/-10 | 380+/-10 | 380+/-10 | 380+/-10 | 1/10mm |
Moment Beared Temperature | -50~340 | -50~340 | -50~340 | -50~340 | °C |
Operation Temperture | -30~300 | -30~300 | -30~300 | -30~300 | °C |
* Graphite thermal grease, the thermal conductivity is 0.965W/m-K~1.974W/m-K
* The Dielectric constant is very high, can withstand voltages above 10 000 volts.
*Low thermal impedance, it can endure paste state.
*Wide Operation temperature range, can keep stable performance between -55~300°C.
*High heat dissipation performance, have Cost-effective.
Composition
Silicone compounds | 50% | 45% | 25% | 5% | % | ||
Carbon Compounds | 30% | 35% | 50% | 65% | % | ||
Metal Oxide Compounds | 20% | 20% | 25% | 30% | % | ||
package | ST | SP | TU | CN | Other | ||
Category | Content | package | Soft tube | Mini package | Syringe | Can | Other |
HY-500 | grey | purple | 20g~25g | 0.5g~1.5g | 0.5g~30g | 30g~1000g | 0.5g~5g |
Different package
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CPU Thermal Paste-ST25g with SGS&MSDS