high thermal conductive pad 1)Thermal conductivity:0.8~6w/mk 2)Elongation:7~10% 3)Dielectric breakdown voltage>6kv

electirc insulation pad

Between electronic components such as Semiconductor, IC, High performance GPU.MOS and heatsink. Led Lighting, LCD TV, LED Backlight TV,Power supply etcTelecom device, Wireless Hub, Memory Modules,RAM IC, in all applications where a metal housing is used as heatsink.

Specification sheet:

Color:variousDensity: 2.5 g/ccThickness Range: 0.5 to 12mmHardness: 25 shore CElongation: 70%Continuous Use Temp: -40 to 200°CVolume Impedance: 8.0 x 1015ohm-cm UL, RoHS, REACH: Compliance

high thermal conductive pad