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LED Lighting Thermal Pad Thermal Gap Filler PadApplications:
- Between electronic components such as Semiconductor, IC, High performance GPU.MOS and heatsink.- Led Lighting, LCD TV, LED Backlight TV,Power supply etc- Telecom device, Wireless Hub, Memory Modules,RAM IC, in all applications where a metal housing is used as heatsink.
Specification Sheet:
Typical Properties of TP150 | |||
Properties | Units | Metric Value | Test Method |
Construction &Composition | ---- | Silicone & Ceramic filled | ---- |
Color | ---- | Dark Gray | Visual |
Thickness Range | mm | 0.5~12.0 | ---- |
Hardness | Shore C | 25 | ASTM D2240 |
Density | g/cc | 2.5 | ASTM D792 |
Tensile Strength | KN/m | 0.5 | ASTM D412 |
Elongation | % | 70% | ASTM D412 |
Continuous Use Temp | -40 to 150 | EN344 | |
Breakdown Voltage | Kv/mm | ≥5.0 | ASTM D149 |
Volume Impedance | ohm-cm | 8.0*1015 | ASTM D257 |
Dielectric Constant | 1MHz | 5.75 | ASTM D150 |
Weight Daminify | ---- | ≤0.3% | @150 240H |
Flame Rating | ---- | V-0 | UL 94 |
Thermal Conductivity | W/m.k | 1.5 | ASTM E1461 |
UL, RoHS, REACH | ---- | Compliance | ---- |
LED Lighting Thermal Pad Thermal Gap Filler Pad