It is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices .
Applications:
Automotive electronics
Telecommunications
Computer and peripherals
Thermally conductive vibration dampening
Between any heat-generating semiconductor and a heat sink
Usage:
Clean impurity on the smearing surface, use scraper, brush, glass bar or injector to smear or fill in the object.
Physical Properties:
PROPERTY | G-200 | G-300 | G-500 | TEST METHOD | UNIT |
Density | 2.3 | 2.7 | 3.2 | ASTM D792 | --- |
Color | Gray | Gray | Gray | --- | Visual |
Volatile Content | 0.5 | 0.3 | 0.2 | ASTM E595 | %/Wt |
Thermal Conductivity | 2.0 | 3.0 | 5.0 | ASTM D5470 | W/mK |
Thermal Resistance | 0.041 | 0.025 | 0.009 | ASTM D5470 | C-In2/W |
Breakdown Voltage | 1100 | 1000 | 600 | ASTM D149 | VAC/mil |
Dielectric Constant | 4.5 | 4.7 | 4.8 | ASTM D150 | --- |
Volume Voltage | >1013 | >1013 | >1012 | ASTM D257 | --- |
Work Temp | -50°C to 200°C |
Thermal paste high conductivity