Silicon Thermal Pad

     Description

    Shenzhen Kuayue Electronic Co., Ltd is specializes in thermal gap filler material many years. We can produce many kinds of  thermal silicon pad,such as HC thermal silicon pad, HCG,HCH,HCB and HCP.

       The silicon thermal pad is made by silicon,which can  take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

     Features & benefits:High reliability & High thermal conductivityHigh compressibility, soft and flexibleNatural stickiness, no extra surface frontal adhesivesMeet with the environmental requirements of ROHS and UL  Aplications:Communication equipment               Mobile equipmentLED Light                                               Video equipmentSwitching power supply                      Networking equipmentBack light model                                   Household appliancesMedical equipment                               PC server/workstations

Silicon Thermal Pad