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High thermally conductive pad for CPU
High thermally conductive pad for CPU
Supplier Info
[China Supplier]
Contact Person : Mr. Chen Tony
Tel : 86-755-28147539, 13923790677
Fax : 86-755-29147529
Product Detail
1.ROHS & UL listed 2.Industry direct price 3.Thermal interface pad 4.High conductivity

High thermally conductive pad for CPU

The HCH high thermal conductivity of silicon pad is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

 

Features & benefits:

1.High compressibility, soft and flexible, designed for applications in low-stress application environment

2.Nice thermal conductivity

3.Electrical insulation

4.Meet with the environmental requirements of ROHS and UL

5.Natural stickiness

 

Typical applications:

1.Laptop

2.Communication hardware equipment

3.High-speed hard disk drive equipment

4.Automobile engine control mould

5.Micro processor, memory chip and graphics processor

High thermal conductivity silicon heatsink pad

 

 

6.Mobile equipment

 

Physical properties:

Test item

Test method

Unit

Test value of HCH series

HCH600 value

HCH500 value

Color

Visual

Blue/Laterite 

Blue/Yellow

Thickness

ASTM D374

Mm

0.25 to 5.0

0.25 to 5.0

Specific Gravity

ASTM D792

g/cc

2.85

2.7

Hardness

ASTM D2240

Shore C

30

30

Tensile strength

ASTM D412

kg/cm2

55

55

Continuous Use Temp

EN 344

°C

-40 to 220

-40 to 220

Volume Resistivity

ASTM D257

Ω-cm

3.1*1011

3.1*1011

Breakdown voltage

ASTM D149

KV/mm

>5.0

>5.0

Flame Rating

UL-94

94-V0

94-V0

Conductivity

ASTM D5470

w/m-k

6.0

5.0

 

Configurations available: 200mm*400mm, 300mm*400mm;  specific size could be provided

according to your requirements.

 

 Packaging:

Carton box & Plastic box-430mm*230mm*120mm for 200mm*400mm size-320mm*320mm*120mm for 300mm*300mm size

 

High thermally conductive pad for CPU

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