1.High thermal performance, 2.UV blocking and AOI compatible, so as to increase productivity efficiency;

UV Blocking and AOI compatible, So as to increase productivity efficiency, high thermal performance,TD≥340°C, T288≥15 Min, suitable for lead free process;  Lower CTE from ambient to 260 °C ;

Application:

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, Lead Free PCB process ect;  

Technical Data Sheet:

Test Item		Test   Condition	Unit	SPEC	Typical   Value
Tg		DSC	°C	≥170	175.2
Peel strength(1OZ)		288°C,10S	N/mm	≥1.05	1.41
Thermal Stress		288°C,10S/solder dip	____	No delamination	180S/ No delamination           No Delamination
Flexural Strength		N/mm2	LW	≥415	580
			CW	≥345	482
Surface Resistivity		After moisture	MΩ	≥1. 0×104	2,52×107
Volume Resistivity		After moisture	MΩ.cm	≥1.0×105	3.21×108
Dielectric Constant		1MHz C-24/23/50	____	≤5.4	4.7
Loss Tangent		1MHz   C-24/23/50	____	≤0.035	0.016
Arc Resistivity		D-48/50+D-0.5/23	S	≥60	122
Dielectric Breakdown		D-48/50+D-0.5/23	KV	≥40	58
Moisture Absorption		D-24/23	%	≤0.5	0.1
Td		Weight loss 5%	°C	340	347
CTE Z—axis	Alpha 1	TMA	ppm/°C	≤60	45
	Alpha 2		ppm/°C	≤300	270
	50-260°C		%	≤3.0	2.9
T288		TMA	min	≥15	30
CTI		IEC60112 Method	V	175~250(Grade 3)	200

CCL thickness and tolerance list

Standard thickness(mm)	tolerance(mm)
	Class B/L	Class C/M
0.025~0.119	±0.018	±0.013
0.120~0.164	±0.025	±0.018
0.165~0.299	±0.038	±0.025
0.300~0.499	±0.050	±0.038
0.500~0.785	±0.064	±0.050
0.786~1.039	±0.100	±0.075
1.040~1.674	±0.130	±0.075
1.675~2.564	±0.180	±0.100
2.565~3.579	±0.230	±0.130
3.580~6.350	±3.00	±0.150

Commonly, we will accept the order from according to the Class B,L ,the Class C/M or other special tolerance could be available upon request.

Class B,C figure the dielectric thickness;Class L/M figures the thickness.

R&D Center:

Inspection Instrument:

Certificates:

Flow Chart:

Raw Material:

Production Line:

Packing and Warehouse:

The services you can enjoy from LESON

Pre-sale consultation

ⅠQuick response on inquires

ⅡConsultation on product properties

Ⅲ Advice of material selection

After sale service

Ⅰ Immediate check of shipping status

ⅡGuide on how to use produts properly

Ⅲ Effective solutions to customer complaints

Advantages

1.We are specialized in this industry for more than 20 years, So that ripe experience is gained and manufacturing engineering can be well controlled.

2. We can design and produce the workpiece according to the customers’ drawings or samples.

3. We have our own professional and technical engineers to give you before and after sale technical support.

4. We can delivery the goods according to order on time.

5. We will try our best to offer a total solution for you.

LEAD FREE( Tg 170 ) FR4 COPPER CLAD LAMINATES SHEETS

Verified Information This information is Verified by TÜV Rheinland and validity period is 2012/10/29 --- 2013/10/29 All the information below may covers both Gold Supplier and its related companies , Their Relationship will be affirmed according to china laws and regulations , also it will be clearly display in the full report >> Production Capacity: Product line name Production Line Capacity Actual Units Produced(Previous Year)

Insulation Materials Product Line	Copper-clad Laminate 145,000 Pieces / Month, Insulation Board 66,000 Pieces / Month, Halogen-free Board 35,000 Pieces / Month, Machined Parts 50,000 Pieces / Month	Copper-clad Laminate 1,450,000 Pieces, Insulation Board 660,000 Pieces, Halogen-free Board 390,000 Pieces, Machined Parts 500,000 Pieces

Export Market Distribution: Market Revenue(Previous Year) Total Revenue (%)

North America	USD 893,447	1.45
Southeast Asia	USD 1,786,894	2.9
Western Europe	USD 1,191,263	1.94
South Asia	USD 2,084,710	3.39
Domestic Market	USD 55,555,556	90.32

Production Machinery: Machine Name Brand & Model No. Quantity Number of Year(s) Used Condition

Vacuum Hot Press Set	Weidi & ZFR	1	3.0	Acceptable
Shearing Machine	Shanghai & QF11-3X1300	6	5.0	Acceptable
Gluing Machine	Xi an Hangtian & SJL-24	3	5.0	Acceptable
FVL-A	L6	3	3.0	Acceptable
Turning Spur	Anpu	3	5.0	Acceptable
Dosing Machine	Xian	1	5.0	Acceptable

Testing Machinery: Machine Name Brand & Model No. Quantity Number of Year(s) Used Condition

Muffle Furnace	Chongming	1	5.0	Acceptable
Copper Foil Resistance to Peel Strength Tester	Meiya & PST	1	5.0	Acceptable
Halogen Tester	Daojin & EDX-GP	1	5.0	Acceptable
Gelation-time Tester	Meiya & GT	3	5.0	Acceptable
Liquidity Experiment Sampling Die Machine	Maiya & RF-P2	1	3.0	Acceptable
Long Arm Thickness Measuring Instrument	Meiya	2	5.0	Acceptable

Production Flow: 0.Inspection 1 1.Raw Inspection 2.Gluing 5.Cutting 1 6.Pressing 7.Cutting 2 8.Laminating 9.Surface Inspection 10.Thickness Inspection 11.Cutting 3 12.Packing 1 13.Packing 2 14.Packing 3 15.Performance Inspection 43.Inspection 2 Testing Report: Report Picture Report Name Report By Product Name & Model No. Report Date

	Test Report	Centre Testing International	Copper-clad laminate & FR-4	2012/05/15
	Test Report	Centre Testing International	Halogen-Free Boards & FR-4	2011/11/08
	Test Report	Centre Testing International	Halogen-Free Boards & FR-4	2011/11/25
	Test Report	Centre Testing International	Insulation Board & FR-4	2012/05/15
	Test Report	Centre Testing International	CEM-3copper-clad laminate & CEM-3	2012/08/18