Advanced thermal conductive pressure sensitive adhesive. Good adhesion strength and superior thermal conductive efficiency

LXH series is made of an advanced thermal conductive pressure sensitive adhesive.They provide a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. XBQ-BP series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices.

P/N	Carrier	Adhesive	Thickness(mm)	180° Peeling Adhesion(PSTC-101)(N/25mm)	Insulation Strength(ASTM D149KV)	Thermal Impedance at 40PSI (AMD2240)(C*in2/W)	Thermal Conductivity (ASTM D22470)(W/m-k)	Temperature Range of Usage
LXH05N	N/A	Thermally Conductive Pressure Sensitive Acrylic	0.05±10%	10.78 or more	1.57	0.414	0.85	-20°C~ +120°C
LXH10N			0.10±10%	13.72 or more	2.22	0.558
LXH15N			0.15±10%	13.72 or more	2.55	0.654
LXH20N			0.20±10%	15.68 or more	4.29	1.070
LXH25N			0.25±10%	15.68 or more	5.0	1.173
LXH30N			0.30±10%	15.68 or more	5.0	1.234
LXH40N			0.40±10%	15.68 or more	5.0	1.525

Note: Above specifications are for reference only. We have our own cutting, die-cutting and molding machine. Any customized sizes or shapes are available. We would try our best to serve you. Please don't hesitate to contact with us if there are anything we can assist you.

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