Semiconductor pumped laser marking machine speed:7000mm/s Marking Depth: 0.50mm Galvo postioning precision: 0.005mm

Semiconductor pumped laser marking machine

Features:

German High-speed marking galvo head,high photoelectric conversion efficiency,high marking speed,fine and permanent marking results

Full optical seal technology,low fault rate,maintence free

It is able to work with diode side pump,diode end pump,fiber and many other types of laser sources

Automatic focus detective and adjustment system can be equipped to meet the drivers needs of marking

Application field:

Suitable for all kinds of ordinary metals and alloys(Iron,copper,aluminium,magnesium,zinc and all metals);rare metals and alloys (gold,silver,titanium);metal oxides,ABS material (electrical appliances case,daily necessities),ink (translucent key-press,printing products),epoxy resin(electronic components packaging,insulation layer)

Technical parameters:

laser beam quality: ≤6

Max.Outout Powe:≤50W

Laser Wavelength:10.64μm/1064nm

Repetition Frequency: ≤50KHZ

Standard Marking Scope: 100mmX100mm(optical)

Marking Depth: ≤0.50mm

Marking speed: ≤7000mm/s

Min.Line Width: 0.015mm

Min.Charactor:0.4mm

Repetition Precision: ±0.01mm

Machine power: 1.5KW

Electric Power Demand: 220V/Single Phase/50Hz/8A

Optical-Path System Size:1220mm*650mm*1200mm

Controlling Size:600mm*600mm*800mm

Cooling System:1.6kw Chiller(Different configuration on different laser sources)

Galvo postioning precision: 0.005mm

Semiconductor pumped laser marking machine for IC