1.High speed,long life 2.Power:50W/75W 3.Max. Thickness of Wafers to Be Scribed:1.2nm 4.Worktable Area:350*350mm

Laser Cell Scriber

GSYS50A

Features:

YAG Laser pumped by krypton lamp, acousto-optic modulated system, CNC X-Y table driven by the step motors;Internationally popular modular design, the key components made in the technically advanced countries;Reliable, accurate, efficient;Upgraded Software V 3.0, easy installation and relocation;Integrated chiller, circulated by const. temperature cooling water to ensure the long-standing stable and reliable operation;

Technical Specifications:

Items	GSYS50A
Accuracy of Scribing	≤±10µm
Iine Width of Scribing	≤50µm
Laser Wavelength	1064nm
Laser Power	50W
Max. Speed of Scribing	120mm/s
Max. Thickness of Wafers to Be Scribed	1.2nm
Repetitive Frequency	200Hz - 50KHz
Worktable Area	350*350mm
Accuracy for Temperature Control	0.5°C
Power Supply	380V(220V)/50Hz/5kVA
Worktable	Absorb wafers and dust-extraction by under pressure
Chiller	Integrated circulated by const. temperature cooling water
Mornitoring	Entry-level

Application: Scribing for mono-crystalline ,silicon,poly-crystalline silicon ,amorphous-crystalline silicon,solar cell, wafer in solar industy.

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