laser ceramic dicing machine 1,CCD image 2, Automation 3, Excellent beam quality, high precision 4, High speed

Laser Ceramic Dicing / Cutting Machine

Principle When the laser beam of high energy intensity is focused on the ceramic surface, the area irradiated by the light spot will  instantly melt and gasify. The laser machine can achieve automatic dicing, cutting and drilling  through computer-controlled CNC mechanical system moving light spot position on ceramic surface. Features

CCD image processing system is optional (Configuration with automatic image recognition and positioning system will achieve marking and cutting on special ceramic surface).;

Automated loading and unloading device: With belt-driven and PLC controling, the system can realize fully automation of loading and unloading;

Manual focus or automatic focus;

High-precision manual or automatic adjustment rotary table will ensure the high accuracy and high resolution of the repetitive positioning;

Good combination of advaced hardware  with  intelligent software;

High quality, Small spot size, Non-contact cutting;

Excellent beam quality,  high precision motion, high speed cutting or dicing,  good stablity , low power consumption, and low noise;

Small heat-affected zone, good cutting quality. Non-contact processing  can aviod stress caused by knife to effectively improve the excllent grade rate of ceramic and sillicon dicing.

Applications Mainly used in  ceramic ( aluminum oxide, nickel oxide, aluminum nitride, nitride of nickel ), and used in processing solar cells, silicon, aluminum sheet, etc., Also used for metal and semiconductor (silicon, germanium, gallium arsenide ). Precision cutting for metal sheet (stainless steel, alloy, ceramic substrates) such as the stainless steel net used by PCB boad silk screen

Laser ceramic dicing/cutting machine specification

Item	PARAMETERS
Laser Type	UV	Fiber
Laser output Power	3W/5W/8W	10W/20W
Laser Wavelength	355nm	1064 nm
Worktable Dimesion	200mm*200mm
Repetitive positioning accuracy	≤+0.01mm
Repetitive frequency	20-80Hz
Max line speed	≤150 mm/S
Line width	0.03mm-0.06mm
Dicing depth	0.05mm
Beam quality	M2≤1.4	M2≤1.3
Consumed Power	1000W	1000w
Electricity requirements	220V AC±10%, 50-60Hz	220V AC±10%, 50-60Hz

Laser ceramic cutting equipment for ceramic wafer