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Product Detail:
Solar Cell Laser Cutting machine
Function and Application:
Applied to cut and scribe solar cell, silicon wafer, thin metal sheet and so onApplicable industries: Solar industry, electronic, semiconductor.Product Advantage:
Excellent Beam QualityReliable PerformanceHigh efficiency, Low defective rateAuto water cooling systemPrecise CNC worktableEasy operationSupport various file formatFast delivery 20 daysCompany Advantage:
6 years experience in the industryGood communication of sales team and after sales team6 years experience in India Market, customer: Moserbaer, LANCO, HBL, Sunfest and so on.After sales service office in Hyderabad India all the year time.Product Parameter:
Parameter: | |||
Wavelength: | 1064 nm | Min scribing line width: | 0.05mm |
Pump source: | Diode Laser | Scribing area: | Max 350mm, customized |
Modulated frequency: | 0.5 - 50 kHz | CNC worktable accuracy: | 0.01mm |
Beam power: | max 50 W | Power supply: | 220 VAC +/- 10%, 50 Hz |
Scribing speed: | max 120 mm/ s | Input power: | Max 2 kW |
Max scribing depth: | 1.2 mm | Temp Control Precision: | 0.5C Degree |
Machine Picture:
Solar Cell Laser Cutting Machine GMS-50D