Brief IntroductionAccording to the requirement of photovoltaic industry development, our company develops a new series of laser scribing machines, which can be widely used to scribe polycrystalline and mono crystalline silicon wafer, non-crystalline silicon solar cell, and to scribe and cut other substrate material of semiconductors such as silicon, Ge, GaAs Material and so on.
Nd-YAG laser system Sound-optical modular Numerical controlled X,Y working table Vacuum adsorbing system Step motor drive controlled by computer
AdvantageThe system of the machine is developed with international prevalent modularization design and its key components are all imported high-quality ones. It has gained customers’ acknowledgement and authorization.• It has the very good performance of high scribing speed • High precision • Comprehensive functions • Simple operation • Long workable time • Long term stability
|Scribing speed||80~100 mm/s|
|Remark||1. 10 hours/per day, 250 days/per year.2. 125mm 2.3W , 156mm 3.6W|
QA Nd-Yag 50W Laser scribing /cutting/ edge /deleting system