offer professional sample making solution to electronic industry. It could be applied in FPC, film switch, photo-electric, cover film industry, etc. It is different from die cutting and laser cutting machine holding advantages of high accuracy, high speed, low cost, high cutting quality.
Characteristics:
Compared with last generation machine, DCG50/DCG51 increase the function of positioning, extending application scope.
comparing with die cutting
1,Save mould unloading cost; 2,save knife sharpening cost; 3,convenient to modify
comparing with laser cutting
1, materials cutting margin is not dark; 2,thin materials cutting will not be burned; 3,there is no glaring lights while working; 4,low usage cost
special functions
1, through and half cutting could be done in one time; 2, 0.5mm cutting accuracy available; 3,plotting or drawing available;4,creaing and cutting could be done in one time while creasing tool equipped.
field of application
1,photoelectric materials sample making;
2,flexible printed circuit board sample making;
3,contact-type film switch sample making
Specifications
Model | DCG301209 | DCG300906 | DCG310906 |
(mm) Effective cutting area | 1200*900 | 900*600 | |
configuration | Pen, cutting tool | ||
Way of absorbing | Vacuum | electrostatic | |
Max speed | 1000mm/s | ||
Cutting precision | <0.05mm | ||
Cutting thickness | <1mm |
DCG30/31 Series Electronic die cutting machine