No 

            Items

                                      Craft Ability 

 1

Surface Finish

HASL,Immersion Gold,Flash Gold,Gold Plating,OSP,Immersion Tin etc.

2

           Layers

2-30 layers

3

  Minimum Line width

                                            3mil

4

Minimum Line space

3mil

5

Min space between pad to pad

3mil

6

Minimum hole diameter

0.10 mm

7

Min bonding pad diameter

10mil

8

Max proportion of drilling hole and board thickness

1:12.5

9

Max size of finish boar

23inch*35inch

10

Rang of finish baords Thick

                                   0.21-7.0mm

11

Minimun thickness of soldermask

10um

12

Soldermask

Green,Yellow,Black,Blue,White,Red,transparent photosensitive,,soldermask,Strippable soldermask

13

Minimum linewidth of Idents

4mil

14

Min Height of Idents

25mil

15

Color of silk-screen

White,Yellow,Black

16

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++

17

E-Testing

100% E-TestingHigh Voltage Testing 

18

Material for PCB

High Tg MaterialHigh FrequenceROGERS ,TEFLON ,TACONIC ,ARLON) Halogen-free Material

19

Other test

Impedance,,Testing,Resistance,,Testing, Microsection etc.,

20

Special technological requirement

Blind & Buried Vias and High Thickness copper