6-Layer OSP / ENTEK PCB, RoHS Compliance. 6-Layer PCB,OSP / ENTEK,Green Solder Mask,Vias Plugged with Solder Mask,RoHS Compliance.

Certificates

ULISO9001TS16949ISO14001

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Testing Items

100% Electrical Test 100% Visual Inspection (including warp & twist check) Dimensional Inspection (finished hole sizes, pcb profiles, etc) MicrosectionSolderability Test (245±5ºC; 3-5 sec) Thermal Test (288±5ºC; 10 sec. inspect delamination, etc) Tape Test (adhesion test) Peel Test (conductor peel strength) Impedance Test Ionic Contamination Test

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Capabilities
Item	Technical Data
Layers	2 - 16 layers
Max Board Size	22" x 30" (558.8x762mm)
Min Board Thickness	2 layers - 8mil (0.2mm)
	4 layers - 16mil (0.4mm)
	6 layers - 24mil (0.6mm)
	8 layers - 32mil (0.8mm)
	10 layers - 40mil (1.0mm)
Max Board Thickness	200mil (5.08mm)
Min Line Width	3 mil (0.075mm)
Min Line Space	3 mil (0.075mm)
Min Hole Size	6 mil (0.15mm)
PTH dia tolerance	+/- 2mil (0.05mm)
NPTH hole dia tolerance	+/- 1mil (0.025mm)
Hole Position Deviation	+/- 2mil (0.05mm)
Outline Tolerance	+/- 4mil (0.1mm)
S/M Pitch	3mil (0.075mm)
Aspect ratio	12:1
Finished Copper Weight	10 oz
Impedance Control	+/- 5%
Insulation Resistance	1E+12Ω(Normal)
Thermal Shock	3x10Sec@288 Centigrade Degree
Warp and Twist	<= 0.7%
Electric Strength	> 1.3KV/mm
Peel Strength	1.4N/mm
Solder Mask Abrasion	>= 6H
Flammability	94V-0
Surface Finishing	HASL, LF-HASL, ENIG, Flash Gold, Immersion Tin, Immersion Silver, OSP,Gold Finger, Peelable Mask, Carbon Printing
Material	FR4, ROGERS, Taconic, ARLON, BT, Ceramic, Aluminum

6-Layer OSP PCB