1

layer

1-12layer

2

Material

FR-4,CEM-1,CEM-3,Hight TG,

3

Board thickness

0.6mm-2mm

4

Max.finished board side

650mm*500mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spaceing

0.075mm(3mil)

8

Surface finish/treatment

Chemical tin,Chemical Gold,Immersion gold /Gold,Osp,Gold Plating

9

Copper thickness

1-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

 standard carton paking

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

ISO 9001:2000   ISO 14001:2004   ISO/TS 16949  

15

profiling punching

Routing,V-CUT,Beveling

16. providing OEM service to all sorts of printed circuit board assembly