NO

ITEM

Technical capabilities

1

Layers

1-20 layers

2

Max. Board size

2000×610m

3

Min. board Thickness

2-layer  0.15mm

4-layer  0.38mm

6-layer  0.55mm

8-layer  0.80mm

10-layer  1.6-2.0mm

4

Min. line Width/Space

0.075mm(3mil)

5

Max. Copper thickness

1-6 OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.1mm(4mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)

+0/-0.05mm(2mil)

10

Hole position deviation

±0.05mm(2mil)

11

Outline tolerance

±0.10mm(4mil)

12

Twist & Bent

0.75%

13

Insulation Resistance

>1012 Ω Normal

14

Electric strength

>1.3kv/mm

15

S/M abrasion

>6H

16

Thermal stress

288°C 20Sec

17

Test Voltage

50-300V

18

Min. blind/buried via

0.15mm  (6mil)

19

Surface Finished

HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold

20

Materials

FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base