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HASL four layer
Category | Item | High-volume processing capacity | Sample and small batch processing |
Technology | Product Category | Single / dual panel, multilayer, high-frequency board, with buried / blind plate | Multi-material mixing pressure |
Surface Treatment | Chemical Immersion Gold, chemical Shen tin, electroless nickel deposit | ||
Lead-free HASL, Electroless silver, osp , Thick gold plating | |||
Plates | Plates | FR-4, CEM3, different high-frequency substrate εr (domestic and imports), Rogers, metal plate substrates (aluminum, copper, iron), halogen-free FR-4 | |
Thickness range | 0.15mm-3.0mm | Less than 0.4mm And Greater than 3.0mm | |
Thickness Tolerance ( t Greater than 0.8mm) | ±10% | ±8% | |
Thickness Tolerance ( t Less than 0.8mm) | ±12% | ±10% | |
Level | Level | 1---8 | 10---16 |
Line | Minimum line width | 0.125mm | 0.1mm |
Minimum spacing | 0.125mm | 0.1mm | |
Route from the tolerance | Greater than 10% | less than 10% | |
Thick copper | The outer layer copper thickness | 18mm-140mm(hoz-6oz) | 18mm-140mm(hoz-6oz) |
Aperture | Drilling diameter | less than 0.30mm | less than 0.2mm |
Pore diameter | less than 0.2mm | 0.00mm--0.10mm | |
Aperture tolerance | 0.05mm | ||
Hole tolerance | 0.075mm | 0.050mm | |
Thickness aperture ratio | 10:01 | 12:1;16:1 | |
Green oil | Solder Type | Photographic Ink | |
Solder bridge the smallest width | 0.125mm | 0.010mm | |
Minimum Solder isolation ring | 0.05mm | 0.025mm | |
size | Accuracy Dimension | ±0.15m | ±0.10mm |
Maximum size | 600mmX1200mm | 1200mm-2000mm | |
Impedance | Impedance Tolerance | ±10% | ±5% |
HASL four layer pcb board,4 layer motherboard pcb