1.2-layer immersion gold pcb 2.Min Hole size:0.3mm 3.Rohs,UL,SGS, ISO 4.12 years experience in pcb Manufacturing

Our  company  superiority: 

1)our product quality:our factory got ISO9001,Ul certificate and  our products meet ROHS standards. So  don't worry,  you  will buy of poor quality  product.

2)our product  fast  delivery time: the shortest  lead  time for Double-side board  is 24 hours, Multilayer board is 48 hour.

3)our  product  with reliable quality at  competitive  price, FOB Price: 0.05USD-30USD, you may at will select.

Specification   and Ability
Certificate	ISO9001;ISO14001;UL
Surface   Finishing	Nickel   plating;immersion Gold;Hot Air Soldering Level(HASL);Electroless Nickel and   immersion Gold(ENIG);Carbon ink;Finger   Gold;Immersion silver/Immersion tin
Max.panel   size	600mm*700mm
Min.panel   size	5mm*5mm
Board warpage	single side   ≤1.0%,double side≤0.6%multi layer ≤0.6%
Min.Thickness	0.2mm±0.08mm
Min.Line   width	0.1mm
Min.line   space	0.1mm
copperfoil   to board side spacing	0.5mm(20mil)
hole   side to line side   spacing	0.3mm(7.87mil)
Min hole   size	0.2mm
Hole inner   copper thinckness	20-25um(0.79mil-1.0mil)
Hole tooling   tolerance	±0.076mm(±3mil)
Min.stamping   round hole diameter	FR-4 board   thinckness 1.0mm(40mil)less; 1.0mm(40mil)
	FR-4 board thinckness 1.2-3.0mm(47mil-120mil)1.5mm(59mil)
Min.stamping   square hole specification	FR-4.CEM-3   board thinckness 1.0mm(40mil) less; 0.8mm x 0.8mm(31.5mil x 31.5mil)
	FR-4.CEM-3 board thinckness 1.2mm -   3.0mm(47mil-120mil) 1.0mm x 1.0mm(40mil x 40mil)
Trace deviation	±0.076mm(±3mil)
Molding tolerance	CNC milling profile   ±0.15mm(±6mil); die profile ±0.15mm(±6mil)
V-CUT   registration accuracy	±0.2mm(±8mil)
product type	single side;double   side; multi-layer & flexible board
Base   Material	FR-4;CEM-1;CEN-3;   High frequency ;Aluminium based board
Process thinckness	0.2-3.5mm
Base   material copper thinckness	18um, 35um, 70um
Min.hole   diameter	0.2mm
Plating thinckness	Gold Plating:   Ni2.5-5um, Au0.05-0.10um
	Immersion gold: Ni5-8um, Au0.08-0.12um
	Finger gold Ni2.5-5um, Au0.05-0.12um
Process ability	20,000 square   meters/month
Profile process	CNC machine
V-CUT   angular tolerance	±5°
V-CUT base   material thinckness	0.6mm - 3.2mm   (15.5mil - 129.58mil)
Min.SMD space	0.3mm (12mil)
Min.component   marking font	0.15mm (5.79mil)
Min. single side solder annular width(finished products)	0.15mm (5.79mil)
Min.   cross-hatching pad	0.076mm (0.3mil)
Min.soldermask   brigde	±0.076mm(±3mil)
Carbon   ink board data	1)1.0 high impedance   control limit:20K±10%;
	2)2.0 hardness:6H
	3)3.0 can bear friction time:over 200000

1.6mm board thinkness pcb board