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CPU Heat sink Compounds-02
CPU Heat sink Compounds-02
Supplier Info
[China Supplier]
Contact Person : Ms. Hwang Melissa
Tel : 86-20-87564478
Fax : 86-20-87564606
Product Detail
Primary Use:Thermal coupling of electrical/electronic devices to heat sinks

Primary Use:Thermal coupling of electrical/electronic devices to heat sinks

Specal properties:High conductivity;Low bleed;Stable at high temperatures

Type:silicone fluid

Thermal Resistance:<0.06oC

Physical From:Grease-like

Thermal Conductivity:>1.05W/m-k

N.W.30 gram

Color:White opaque

Dielectric Breakdown:>5.0 KV ac

CPU Heat sink Compounds-02

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