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Primary Use:Thermal coupling of electrical/electronic devices to heat sinks
Specal properties:High conductivity;Low bleed;Stable at high temperatures
Type:silicone fluid
Thermal Resistance:<0.06oC
Physical From:Grease-like
Thermal Conductivity:>1.05W/m-k
N.W.30 gram
Color:White opaque
Dielectric Breakdown:>5.0 KV ac
CPU Heat sink Compounds-02