0.6mm 250K BGA Lead Free Solder Ball

Description: 1) 0.6mm  BGA Repair Solder Ball Lead Free can only can be applied in lead free solder reworking.2) Below are the details:Balls Size: 0.6mmBalls Alloy: Sn 96.5 / Ag 3 / Cu 0.5(SGS Tested and Certified)Qty: 250K pcs / BottleGross Weight: 246gROHS available, SGS certified.3) ThisBGA Repair Solder Ball Lead Free can be use to repair notebook, computer and xbo360, PS3, WII bga repair.

What others you may need?1. 250K and 25K pcs Leaded solder ball and Lead free solder ball  from 0.25-0.76mm.2. BGA stencils and reballing station.3. BGA rework stations ACHI IR 6000 or ACHI IR-PRO-SC or hot air guns.4. Other accessories for bga rework.

0.6mm 250K BGA Lead Free Solder Ball