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PS400 High auto laptop bga repair machine
Specification
Upper heater: hot-air 1000W Lower heater: hot-air& infrared 1000W
Bottom preheatfar infrared: 3000W Power supply: single-phase 220V,50/60Hz,4.5KW
Workable PCB dimension: 20x20~450x400mm Workable PCB thickness: 0.5mm ~ 3mm
Workable BGA dimension: 1x1mm ~ 70x70mm Min pitch of BGA ball: 0.15mm
Placement precision: 0.01mm Max. BGA weight: 300g
Machine dimension: L850×W700×H950mm Weight: Appox. 80Kgs
Description
The streamline design is gorgeous and room-saving.Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function.Upper/lower hot-air heating,bottom infrared,three independent heating areas, temperature and time can be displayed digitally on the touch screen.Powerful cross flow fans cool the bottom heating zone rapidly and constantly.Color optical system with functions of spilt vision, zoom-in and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 22X optical zoom. Embedded industrial computer can analyze the two practically-tested profiles, and compare them with the history saved profiles;profile saving no limit for the industrial computerColor LCD monitor, touch screen interface;Built-in vacuum pump;60 rotating inφ angle mounting nozzle is micro-adjustable.8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range.Equipped with different hot air nozzles, easy to replace and able to locate in any angle.Big size splint, equipped with deformation-proof supporting device, suitable for the accurate rework of all kinds of PCB.Can handle 775 socket, 478 socket, XBOX360, PS2/3 etc.PS400 High auto laptop bga repair machine