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l Mechanical gripper centering system: mechanical centering position uses all size Parallel claw, which is suitable for mounting SMD plate-like Chip components 0402, SOIC,PLCC and QFP IC.
l High-precision lead screw driving system: TP45.C, pre-pressure seamless lead screw driving system with the loop DC servo motor and high precision encoder.
l No-contact laser centering system: it can suitable for picking and placing all SMD component: 0201 (0.6mmx0.3mm)SOIC,PLCC and QFP IC (0.5mm pitch)
l Flexible Reference point system (RPS): In addition to standard Round reference point, square PCB pad and ring PCB pad with hole also can be identified as a reference point.
l Dispensing and solder paste system: the machine equips with glue or solder paste distributor.
Type | TP45N |
Mounting speed | Normal: 3600 CPH, Max: 4000CPH |
Centering way | 1 laser centering system or vision centering (optional) |
Feeder (Qty) | Max 88 pcs (8/12mm) without conveyor belt |
Feeder(Qty) | Max 44 pcs (8/12mm) with conveyor belt |
IC tray (Qty) | 4 at most |
Component size (mm) | Min: 0201(0.6 X 0.3) |
Max: 20 X 20 | |
Max (vision centering ):38 X 38, 48 X 48 (optical: AQ48),62 X 62 (optical: AQ62 ) | |
X/Y axis driving system | High-precision lead screw system and servo motor |
Resolution | X / Y axis 0.0075mm, Z axis 0.02mm |
rotate resolution | 0 to 360° (0.09°/step) |
Repeating accuracy | (machine) +/- 0.1mm; (vision) +/- 0.05mm |
PCB size | 450 X 350mm (using feeder chassis on one side), 350 X 320mm (using feeder chassis on four sides) |
Program | Keyboard input, Video study, CAD data transfer (Optional) |
Component induction | Vacuum or laser |
Main controller &display | IPC& VGA display |
Dimension(mm) | 1030 X 940 X 1250mm (L x W x H) |
Net weight | 400kg |
Power supply | 240V |
Current | 100A, AC |
Power | 1200W |
Gas pressure | 75 psi (5.5 bar) |
Automatical mounter TP45N