Metal Package for HIC Material:4J29(FeNiCo) alloy. Surface plating:selective Au plating.

Metal Package for HIC

Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.

Material:4J29(FeNiCo)  alloy.Surface plating:selective Au plating.

Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.

Metal Package for HIC