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wafer tape
wafer tape
Supplier Info
[China Supplier]
Contact Person : Ms. Wang Sarah
Tel : 86-755-61514569
Fax : 86-755-61514586
Product Detail
1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm

 Description:

- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water

Feature:

*Wafer dicing, Wafer protection

*UV curing type

*Expandable type

*Precented dicing wafer from penetrating into interface

*Improved back side chipping

*Improved back side contamination by wafer

*Adhesive strength depends on chip size, chip thickness,etc

Specification:

Color:  White

Thickness: 130um

Base Film: Polyolefin/100um

Adhesive: 30um

Adhesion before UV: 3.00 N/10mm

Adhesion after UV: 0.22 N/10mm

 Note:  UV irradiation should be satisfied the following conditons in order to ensure the standard value

1) more than 100mW/cm2 of illuminance

2) more than 200mJ/cm2 of quantity of UV light

3) Wave length of ultraviolet should be around 365nm

wafer tape

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