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1: GE process standards, product positioning semiconductor chip high-end market.
2: Product parameters good consistency. Export products and domestic product orders and all required delivery. No screening .
3: On-state power consumption is small, with excellent thermal fatigue characteristics.
Wafer Diameter±0.1 | Control polar diameter | Cathode internal diameter | Cathode outer diameter | VDRM/VRRM | TVJM |
mm | mm | mm | mm | mm | °c |
25.4 | 2.7 | 5.2 | 20.5 | 100-6500V | 125 |
30 | 2.7 | 5.2 | 25 | 100-6500V | 125 |
30.48 | 2.7 | 5.2 | 25 | 100-6500V | 125 |
35 | 3.4 | 6.2 | 29 | 100-6500V | 125 |
38.1 | 3.4 | 6.2 | 31 | 100-6500V | 125 |
40 | 3.4 | 6.2 | 33 | 100-6500V | 125 |
50 | 3.4 | 8.8 | 43.8 | 100-6500V | 125 |
55 | 3.4 | 8.8 | 47 | 100-6500V | 125 |
63.5 | 6.2 | 10 | 55 | 100-6500V | 125 |
76 | 6.2 | 10 | 67 | 100-6500V | 125 |
85 | 6.2 | 10 | 76 | 100-6500V | 125 |
99 | 6.2 | 11 | 88 | 400-6500V | 125 |
GE craft high voltage thyristor chip in abundant supply(KP4"-4200V)