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Best Quality Thermal Silicon Pad, 5.0 W/mK, 2CM*2CM*2MM, Laird Tflex 700 Series Gap Filler Material
Best Quality Thermal Silicon Pad, 5.0 W/mK, 2CM*2CM*2MM, Laird Tflex 700 Series Gap Filler Material
Supplier Info
[China Supplier]
Contact Person : Ms. Sang Merry
Tel : 86-755-2698802
Fax : 86-755-2698802
Product Detail
Best Quality Thermal Silicon Pad, 5.0 W/mK, 2CM*2CM*2MM, Laird Tflex 700 Series Gap Filler Material

Best Quality Thermal Silicon Pad, 5.0 W/mK, 2CM*2CM*2MM, Laird Tflex 700 Series Gap Filler Material 

For Laptop, Desktop, Chip, etc 

Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.

Tflex™ 700’s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance.

Tflex™ 700 is naturally tacky, and requires no additional adhesive coating to inhibit thermal performance. Tflex™ 700 is electrically insulating, stable from -45ºC thru 200ºC and meets UL 94V0 flame rating.

    

Best Quality Thermal Silicon Pad, 5.0 W/mK, 2CM*2CM*2MM, Laird Tflex 700 Series Gap Filler Material

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