A.Main characters:High thermal conductivity; Low thermal expansion; Good thermal shock resistance; High electrical resistance; Low dielectric constant and loss tangent; Microwave transparency; Easily machined non abrasive and lubricious; Chemically inert; Not wet by most molten metals

B. Using:Boron doping wafers in silicon semiconductor processing; Vacuum melting crucibles; CVD crucibles; Microcircuit packaging; Sputtering targets; High precision sealing, brazing, and metallizing fixtures; Microwave tubes; Horizontal caster break rings; Low friction seals; Plasma arc insulators; High temperature furnace fixtures and supports

C. We can make as customer's requirements

Boron Nitride