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Copper-base P/M Friction
| Process Parameter | Copper Base(Foil-Sintered) | Copper Base(Sprinkling-Sintered) | |
| Wet Application | Dry Application | Wet Application | |
Dynamic Coefficient(μd) | 0.05-0.08 | 0.2-0.35 | 0.06-0.10 |
Static Coefficient(μs) | 0.11-0.15 | 0.2-0.35 | 0.11-0.15 |
Wear RatioX10-8(cm3/J) | ≤5 | 5 | ≤5 |
| Pressure(Max.)((N/mm2) | 3.5-6 | 1-3 | 4-6 |
| Energy X Power(Cm) | 20000-40000 | -- | 25000-45000 |
Copper-Base P/M Friction Plate