Product Technical Specification of Moko Technology Ltd

Item

Parameter

Double sided

Multilayer

Number of Layers

2

4~16

Copper Thickness

0.25~3.0OZ

0.5~3.0OZ

Base Board Thickness

0.3~3.2mm

0.6~3.2mm

Incombustibility

94V-0

94V-0

Peelable resistance

12.3N/cm

12.3N/cm

Twist

≤0.5%

≤0.5%

Insulation resistance

≥1011Ω

≥1011Ω

Test voltage

10-300V

10-300V

Finished board area

560×970mm

560×970mm

Min. Line Width and Spacing

0.1/0.1mm

0.1/0.1mm

Copper thickness in hole

≥25.0um

≥25.0um

Mini. pad diameter

Inner layer

0.05mm

Out layer

0.076mm

0.076mm

Mini. Hole Diameter

0.25mm

0.20mm

Hole tolerance

PTH

±0.076mm

±0.076mm

NPTH

±0.05mm

±0.05mm

Hole location tolerance

±0.076mm

±0.05mm

profile tolerance

Routing

±0.1mm

±0.1mm

Punching

±0.13mm

±0.13mm

Solder mask bridge ability

≥0.1mm

≥0.075mm

Solder mask rigidity

6H

6H

Solderable test

245 Degrees Centigrade     5 second

245 Degrees Centigrade     5 second

Thermal cycling ability

288 Degrees Centigrade   10 second

288 Degrees Centigrade    10 second

Surface Finishing

OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger

OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger