Features:

  1. Intelligent thermal fuse, it doesn’t work when fan no working.

  2. Three independent heating zones, suitable for lead free process.

  3. Quality heating material in the 1st and 2nd zones of BGA, which make hi-temperature with breeze that is superior to infra heating board only.

  4. The 3rd heating zone with warm far-infrared heating panels, adjustable support agencies, to prevent the deformation of PCB board.

  5. Six sections temperature zone control, complete simulation of the effect or reflow soldering machine.

  6. At area of BGA, Hot wind heats up and down, mimic the effect of hot wind reflow station.

  7. Upper heating system can be moving fro and back, up and down.

  8. Big flow constant current cools PCB for better welding effort after Heating finish, prevent PCB deformation.

  9. Sound hint function for BGA disassemble and welding.

  10. Portable vacuum pen takes out BGA, convenient and durable.

  11. Special pallet is for different PCB board.

  12. Various sizes heating nozzles, or custom made.

  13. PLC control, control temperature precision, stable function.

  14. Move quickly along X.Y between PCB splints, precision adjust as well.

  15. Hot-air nozzle with a variety of sizes, or according to customer special requirements made.

  16. The com interfaces, and computer connections, repair machines to achieve high-end features. Host computer with monitor and itself.

  17. Rich software features: simple and friendly interface, set, modify, save the parameters, parameter sets no limit.

  18. The temperature curve test, analyze, print, save; automatically track the heating process, heating process curve of automatic drawing; temperature setting, temperature deviation correction. Password locking, permitting.

BGA/CSP Rework Station TL-300