Ads by Google
hot air bga rework station for xbox360 motherboard, etc
hot air bga rework station for xbox360 motherboard, etc
A: the world's most advanced "intelligent control system" (Intelligent control system), referred to as "ICS", for BGA rework desoldering more humane, more simple, more intelligent.
B: super-failure alarm function, the control system integrated fault detection and alarm the following1: K-type thermocouple open alarm detection and fault protection. For temperature control, temperature overshoot and other faults no longer occur.2: up and down the hot air fan fault detection and fault alarm protection. Let the heater burning phenomenon in history, to maximize the protection of machines and personal safety.3: The heater fault detection and fault alarm, the machine's real-time status at a glance.
C: up and down the hot air flow speed of electronic intelligence. For each different temperature curves match different wind speeds, improve repair efficiency and improve the success rate of repair. Eliminating tedious repetitive traditional mechanical machine speed adjustment.
D: Y direction of the PCB with dual clamping frame, to meet the larger PCB fixed.
Basic functions:1 high-precision imported raw materials (PLC. heater) precise control of the BGA rework process.
2 The machine uses three independently controlled temperature zones, a more accurate temperature control of the first zone second zone can be set to 8 liters (down) and 8 segments constant temperature control, which can store 10 sets of temperature curve. third zone using warm, independent temperature control, to ensure that the PCB in the welding process can be fully preheated,
3 selection of imported high-precision thermocouple, the temperature precision to achieve detection.
4 using the top and bottom heating temperature of the heating curve way to go alone, cross-flow rapid cooling fan works to ensure that PCB in the welding process, is not deformed.
5 desoldering and soldering 20 seconds in advance of completion of progressive alarm, with a vacuum suction pen for easy desoldering suction times after the BGA.
6. PCB positioning using V-shaped slot, flexible and convenient removable fixture, the PCB has protective effects.
7 for large high-temperature heat capacity of PCB and other requirements, so you can easily handle lead-free solder.
8 hot air nozzle can be rotated 360 degrees, easy to replace. Hot air nozzle with a variety of sizes, special requirements can be customized. Motherboards for notebook computers, desktop computer motherboards, and other large circuit board repair, and other miniature mobile motherboard chip repair
Looking for distributor worldwide now!
Official agent only: USBEARTH TECHNOLOGY (HK) COM., LTD.
2011/3 released,the most favourate BGA model for personal or workshop use.
2011 best selling LY R590 hot air bga rework station for xbox360 motherboard