Automatic Die Bonder For LED (Multi-purpose) MB362 1.UPH: 14K 2.Work Holder Table: 10" x 4" 3.Multi-Wafer Table: 6" x 6"

DB POWER---Die Bonder Characteristics:

 Applied to all kind LED Die lead frame Increased output by over 80% in comparison with KB-2600 Double-vision positioning system to keep Die Bonding accuracy Uniform and high precision stamping of High Power LED Die Bonding User friendly withA Windows Chinese operation Aservomotor control system ensures the precision and yield rate of products.

Automatic Die Bonder LED making machine