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Red ESD Foams (Conductive Foam, PE/PU/EVA Foam, Packing Foam)
Conductive property good for grounding IC leads against ESD damage |
Suitable for semiconductors storing and shipping |
Non-corrosive and good cushioning effect |
Available in high density, semi-hard and low density foam |
Surface resistivity <106 ohms/sq |
Specification For Black Conductive PU Foams
Typical and Data Test Method
Density | 3.1 lbs | ASTM D3575-84 |
Surface Resistivity | L104 | ASTM D991-85 |
Volume Resistivity | 1.1 x 103 | ASTM D991-85 |
H.C.F.C. | Chemically Insert | Fed STD 101 °C Method 3005 |
Static Decay | .01 Sec. | ASTM D991-85 |
Tribo Charge | Pass | Modified Incline Plane (Bellcore) |
Non-Corrosive
Chlorides | 0.21% |
Sulfates | 0.01% |
Conductive Corss-linked Polyethylene Nominal Specifications ELECTRICAL PROPERTIES Typical #118alue
PROPERTY | TEST METHOD | UNIT OF MEASURE | LCX-200 | |
Volume Resistivity | ASTM-991(1) | OHM-CM | <10 4 | |
Static Decay Rate | Fed. Std. 101 Method 4046 (2) | Seconds | <.01 | |
Static Decay Rate | '(3) ASTM-D257 | OHMS / Square | <5 x 10 5 | |
Surface Resistance | '(4) NFPA-56A | OHMS | Solid Sheet | < 2 x 10 5 |
Shunt Resistance | '(5) | OHMS | < 16K | |
Red ESD Foams