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FR-4, multi-layer pcb,Detailed technical requirements:
layer:6material:FR4(SY)Board thickness: 1.0mmSurface finish:immersion goldMin through hole:0.1mm(4mil)Min line width:0.1mm
PCB ,PCB board,PWB
HCC INTERNATIONAL craft capacity:
No | Items | Craft Ability |
1 | Surface Finish | HASL,Immersion Gold,Flash Gold,Gold Plating,OSP,Immersion Tin etc. |
2 | Layers | 2-30 layers |
3 | Minimum Line width | 3mil |
4 | Minimum Line space | 3mil |
5 | Min space between pad to pad | 3mil |
6 | Minimum hole diameter | 0.10 mm |
7 | Min bonding pad diameter | 10mil |
8 | Max proportion of drilling hole and board thickness | 1:12.5 |
9 | Max size of finish boar | 23inch*35inch |
10 | Rang of finish baords Thick | 0.21-7.0mm |
11 | Minimun thickness of soldermask
| 10um
|
12 | Soldermask
| Green,Yellow,Black,Blue,White,Red,transparent photosensitive,,soldermask,Strippable soldermask |
13 | Minimum linewidth of Idents | 4mil |
14 | Min Height of Idents | 25mil |
15 | Color of silk-screen | White,Yellow,Black |
16 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
17 | E-Testing | 100% E-TestingHigh Voltage Testing |
18 | Material for PCB | High Tg MaterialHigh FrequenceROGERS ,TEFLON ,TACONIC ,ARLON) Halogen-free Material |
19 | Other test
| Impedance,,Testing,Resistance,,Testing, Microsection etc.,
|
20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
we are a professinoal PCB/PCBA manufacturer with ISO9001;2000 approval,ISO14001:2004 and the UL approval.we provide PCB layout,PCB design,PCB fabricaton,PCBA,PCB assembly,FPC,rigid board,flex board,rigid-flex board,Blind via board,bured via board,single board,double-sided board,multi-layer board.Hasl board,immersion gold,immersion silver,plating gold.
we sincerely hope hear your enquiry and further suggestion which give us the privilege of working with you.
Immersion gold PCB