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1, Base material: Aluminum Nitride Ceramic 2, Thickness: 2.0 mm 3, Layer: 2 4, Copper thickness: 1.50 oz 5, Min hole size: 3.0 mm 6, Min line width /spacing: 2.0 mm 7, Surface treatment: Gold plating8, Special: UL ISO SGS
More Product Features1, HS Code: 8548900090 2, Standard: Ipc Ii 3, Productivity: 5000000PCS/Month 4, Origin: China 5, Packing: Vacuum Packing 6, Min. Order: 1 7, Type: Rigid PCB8, Number of Layers: Double Layers 9, Dielectric: Ceramic
OSP Double-sided Ceramic substrate PCB with UL/ETL certification