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Our PCB Production Capability for OSP Board | |
Bass Material | FR4 |
Layer Count | 2 |
Thickness of Board | 1.2mm |
Thickness of Base Copper | Outer:1OZ Inner:1OZ |
Surfacing | OSP |
Solder Mask color | Green |
Silkscreen color | White |
Min. hole | 0.25mm |
Min.line width | 0.1mm |
Min.line spacing | 0.1mm |
Our PCB Production Capability | |
Base Material | FR4/CEM/Aluminum/Non-halogen |
Layer Count | 1-20 layer |
Thickness of Board | 0.2-3.0mm |
Finishing | HAL(LF)/ENIG/Gold finger/OSP |
Min. hole | 0.2mm ( 8 mil ) |
Min.line width | 0.1mm ( 4 mil ) |
Min.line spacing | 0.1mm ( 4 mil ) |
Solder mask | Thickness:16~35um |
S/M bridge:min:5mil | |
Hole size of plug:0.3~0.55mm | |
Certificate | UL-796 certified (E334023) ISO 9001: 2008ISO14001:2004 |
Leadtime | sample:Double-layer:1-3 days; Multi-layer:2-5 days |
mass: Double-layer:3-7 days; Multi-layer:7-9 days |
Double layer OSP pcb manufacturer